FR
Electronic Components
Production Tools & Equipment
Industrial Components
Request Samples
Epoxy Mold Release No Silicones

Epoxy Mold Release No Silicones


MPN: 8329-350G Manufacturer: MG Chemicals
Apply this release to a surface before pouring in encapsulating and potting compound. It allows for a clean removal of the cured epoxy. For use with all types of epoxies and phenolic resins.
Price:
Related Products

Help