What's Hot
LOCTITE Thermal Management Materials
As footprints in today's electronic devices decrease, the need to effectively control thermal load has never been greater. Henkel has responded to the demand with an extensive product line-up of thermal management materials to suit every heat control requirement.
Adhesive Films
When there is a requirement for bonding large areas or complex parts together, thermal adhesive films are the preferred materials. Larger bonding areas are problematic for pastes and other liquid-based mediums, as voids may result; films, however, deliver uniform, void-free bondlines and controlled thicknesses. Supplied in custom, pre-cut formats, Henkel's line of thermal adhesive films offers a clean, waste-free, easily processed solution with a low total cost of ownership in thermally and electrically conductive formulas.
Applications
- Automotive electronics
- Consumer and industrial electronics
- Defense and aerospace electronics
- Handheld communications and computing
- Green and portable energy (solar)
- LED lighting
- Medical electronics
- Radio frequency identification (RFID)
- Wireless datacom infrastructure
Solutions
Thermally Conductive:
Loctite Ablestik 506
Loctite Ablestik 561K
Loctite Ablestik 563K
Electrically Conductive:
Loctite Ablestik 5025E
Loctite Ablestik CF 3350
Loctite Ablestik ECF 561E
Adhesive Pastes
Henkel's adhesive pastes provide robust mechanical attachment, allowing for the elimination of fasteners such as screws and clips, which also helps reduce device size and weight to align with the trend toward electronics miniaturization. With the ability to maintain thin bondlines and excellent thermal paths, Loctite brand adhesive pastes provide superb thermal management.
Applications
- Heatsinks
- Ceramic boards
- Permanent and non-permanent assemblies
Solutions
Room Temperature Cure Shimming Pastes:
Loctite 315
Loctite 3873
Heat Cure Shimming Pastes:
Loctite 5404
Loctite Ablestik QMI529HT
Loctite Ablestik QMI536HT
Room Temperature Cure Non-Shimming Pastes:
Loctite 383
Loctite 384
Loctite 3874
Loctite Ablestik 2151
Heat Cure Non-Shimming Pastes:
Loctite Ablestik 8700K
Loctite Ablestik E 3503-1
Loctite Ablestik TE 3530
Phase-Change Materials
Loctite phase-change films deliver on-demand performance with none of the drawbacks of traditional greases. These materials are solid at room temperature, but melt and flow during device operation to provide a thin bondline and high reliability without the "pump-out" often experienced with some thermal greases. The need for effective heat dissipation is critical for power modules. Henkel's Loctite TCP thermal interface material is incorporated at the design phase to ensure reliable performance over the long term and significantly reduces contact resistance between the metal area on the power semiconductor and heat sink. The material can be screen printed to control for specific patterns and thicknesses to accommodate specific applications.
Applications
- CPUs
- GPUs
- IGBTs
- Discrete components
Solutions
Loctite ECF 1000
Loctite EIF 1000
Loctite PSX 8
Loctite PSX 4000 Series
Loctite TCF 1000
Loctite TCP 7000
Thermal Absorbent Films
Henkel's Loctite TAF series product line consists of market-first thermal absorbent film materials that effectively absorb, spread, insulate and conduct IC-generated heat that is often the cause of high skin temperature in consumer handheld devices. Not only do the materials absorb thermal energy, they also have insulation and controlled directional thermal conductivity to reduce skin temperature. With unique properties that enable the material to be dynamic, Loctite TAF series films regulate heat and the inherent temperature rise and fall of CPU processing. Contourability and application-specific thicknesses make the Loctite TAF series of thermal absorbent films ideal for high-density, space- limited applications.
Applications
- ICs
- CPUs
- Handheld devices (smart phones, tablets, portable gaming, etc.)
- All-in-one PCs & notebooks
- Portable projectors
- Ultra-thin notebooks
- Displays
Solution
Loctite TAF Series
Thermal Greases
For manufacturers with a preference for traditional thermal greases, Henkel has several RoHS-compliant formulations. Used in high-performance applications where minimal bondline thickness is essential for high thermal performance, greases offer immediate functionality upon application. In addition, greases have a tendency to compensate for voids easily, so they are a particularly viable solution for devices that have flatness or coplanarity issues. Available in cartridges or bulk containers, Henkel's thermal greases include high- performance, high-temperature reliability, silicone-free and water-cleanable formulas.
Solutions
Loctite NSWC 100
Loctite TC 4
Loctite TC 8M
Loctite TCP 8175M1
Loctite TG 100
Thermal Pads
Henkel's latest innovation, thermal gap pads, is a solution for mechanical offset applications found in almost every electronic device. Designed in a range of thicknesses and thermal conductivity capabilities, Loctite thermal gap pads have been developed to address specific heat processing needs. The Loctite TFX product line, for example, is designed to provide a high level of compliance or softness and is available in thermal conductivity performance that ranges from 1 to 3.3 W/mK. All Henkel thermal gap pads comply with RoHS and are available in 200 mm x 300 mm sheets with a range of thicknesses from 0.3 mm to 5.5 mm. Customers may also select specific die-cut pads.
Solutions
Loctite TFX 1000
Loctite TFX 1100
Loctite TFX 3000
Loctite TFX 3300
