LOCTITE Ablestik QMI529HT Heat Cure Shimming Adhesive Paste 20.5g
MPN: 1388782 Fabricant: Henkel-LOCTITE
ID MFG: 1388782
LOCTITE Ablestik QMI529HT is used for component or die attach where very high electrical and thermal conductivity are required. Suitable for high heat dissipation devices and solder replacement applications.
Produits relatifs
-
LOCTITE Ablestik TE3530 Heat Cure Non-Shimming Adhesive Paste 10cc 25g
-
Conductive 2-Part Epoxy 2 x 7 Gr Syringes
-
MG Silver Conductive Epoxy Adhesive 19.4g/0.52oz Syringe
-
Solder Wire No Clean SN63 Crystal 400 3C .020-1 (0.56mm) 500gm Spool
-
F Style Mixing Nozzles 490ml Stepped Tip 8mm 9.1'' 24 Elements 10:1 Mix Ratio 10/Pk