Solder Paste SN63 MP200 AGS90.0 Wide Process Window No Clean 500gm Jar
MPN: M00439 Fabricant: Henkel-LOCTITE
ID MFG: 524301
Multicore MP200 solder pastes have been formulated as no-clean, Sn/Pb solder paste for high speed printing and reflow in both air and nitrogen. It has been formulated to have increased reflow operating window. Soft residues make pin testing easier eliminating any need for cleaning. Resistant to both hot and cold slump. 63S4 alloy offers an instant solution where tombstoning is a particular process problem.
IDH#524301
IDH#524301
Produits relatifs
-
Indium Solder Paste 8.9HF SAC305 No-Clean Type 4 88.5% 500g Jar
-
Indium Solder Paste NC-SMQ92H SN63/Pb37 Leaded No-Clean Type 3 90% 700g Cartridge
-
Indium Solder Paste 10.1 SAC305 No-Clean Type 4 88.5% 700g Cartridge
-
Thread Sealant 571 Pipe Sealant HVV 250 ml Bottle
-
LOCTITE 4014 MD Instant Adhesive 20 gm Net Wt. Bottle