Soder-Wick BGA The most effective, economical way to safely and completely remove solder from BGA pads and chips
• Sized and designed specifically for BGA pad and chip rework/repair
• Entire BGA pads cleaned in three to four passes
• Available in rosin and no-clean fluxes
• Packaged in ESD-safe static dissipative bobbins
• Sized and designed specifically for BGA pad and chip rework/repair
• Entire BGA pads cleaned in three to four passes
• Available in rosin and no-clean fluxes
• Packaged in ESD-safe static dissipative bobbins
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