• Used in the rework and repair of printed circuit boards, computers, cell phones, or other electronics
• Easily removes solder from components or pads on a circuit board
• Concentrated fine copper braiding utilizes less length of wick for each desoldering application
• Made of clean, oxide-free copper wire; tight weave enables quick “on and off” desoldering
• Formulated with a flux designed for higher activation temperatures
• To be used in conjunction with processes using RMA type no-clean fluxes
• Uses flux classification type L0 per IPC J-STD-004B - compatible with R, RA, RMA, and NC type fluxes
• Easily removes solder from components or pads on a circuit board
• Concentrated fine copper braiding utilizes less length of wick for each desoldering application
• Made of clean, oxide-free copper wire; tight weave enables quick “on and off” desoldering
• Formulated with a flux designed for higher activation temperatures
• To be used in conjunction with processes using RMA type no-clean fluxes
• Uses flux classification type L0 per IPC J-STD-004B - compatible with R, RA, RMA, and NC type fluxes
S'il vous plaît nous contacter (514) 956-0056 ou
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