Soder-Wick No Clean SD The fastest, cleanest no-clean flux desoldering braid packaged in static dissipative bobbins
• Soder-Wick No Clean packaged in ESD-safe static dissipative bobbins
• Minimizes the risk of damage associated with static electricity
• Patented noncorrosive, halide free, organic no-clean flux
• Desolders up to 40% faster than competitive no-clean braids and leaves boards cleaner
• Meets Bellcore TR-NWT-000078 and ANSI IPC SF-818 for Surface Insulation Resistance
• Meets parameters tested by the Singapore Institute of Standards and Industrial Research (SISIR) for Solderability
• ANSI/IPC J STD-004, Type ROL0
• Soder-Wick No Clean packaged in ESD-safe static dissipative bobbins
• Minimizes the risk of damage associated with static electricity
• Patented noncorrosive, halide free, organic no-clean flux
• Desolders up to 40% faster than competitive no-clean braids and leaves boards cleaner
• Meets Bellcore TR-NWT-000078 and ANSI IPC SF-818 for Surface Insulation Resistance
• Meets parameters tested by the Singapore Institute of Standards and Industrial Research (SISIR) for Solderability
• ANSI/IPC J STD-004, Type ROL0
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