LOCTITE GC18 Temperature Stable and Low-Voiding Solder Paste Type 4 500gr Jar
MPN: 2472691 Manufacturer: Henkel-LOCTITE
LOCTITE GC 18, Solder Paste, Halogen-free, Pb-free soldering
LOCTITE GC 18 is a low voiding, Pb-free solder paste specially formulated to provide low voiding when soldering Bottom Terminated Components (BTC- QFN, DPAK and LGA).
This material is also designed to enhance stability in printing applications. Please refer to the TDS for options and configurations.
No refrigeration
No refrigeration
- Low Voiding: < 25% voiding across small and large BTC
- Good resistance to graping in demanding reflow profiles
- Pin-testable post-reflow residues after four reflow cycles
- Compatibility with approved encapsulant technologies
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